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Backside Grinding/Backside Metallization Tape

Item Unit BGT-001 BGT-002 BGT-003 BGT-004 BGT-005 BGT-006 BGT-007
Backing Thickness um 100 150 100 150 300 350 290

Backing Type

  PET PO PET PO PET PO PET
PSA Thickness um 20 20 30 30 30 30 30
Adhesion Before UV gf/25mm 200 240 1800 1600 ≧800 ≧600 ≧1600
(silicon wafer) After UV gf/25mm - - <30 <30 ≦100 ≦150 ≦100

Features

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1.Non-UV Type
2.General BG
1.Non-UV Type
2.General BG
1.UV Type
2.General BG
1.UV Type
2.General BG
1.UV Type
2.BGBM Process
3.Anti-warpage
4.Heat Resistance
1.UV Type
2.BGBM Proces
3.Anti-warpage
1.UV Type
2.BGBM Process
3.Anti-warpage
4.Heat Resistance

Clean Pad

Item Yield Rate O/S Rate Wear Out Life Time Features

CP Series

>98% <0.5% N 100,000

Effective Cleaning

Improve Test Yield

Needle Shape Protection

Practically Without Abrasion

Tip Types: Crown/Point/Flat/Bullet

FT Series

>98% <0.5% N >300

Release Layer for Laser debond

Products Solid Content Curing Condition Viscosity Color Features
% cps

Thor-100

5±2 100 <100 Colorless

Laser debonding

Thor-200A

8±2 240 <100 Black

Laser debonding

Thor-200B

15±2 240 <100 Black

Laser debonding

Colorless Polyamic acid

Products Solid Content Viscosity Imidization Color Features
% cps

JC-730

12±2 2000-4000 300 Light yellow

High clarity, Heat-resistant, Chemical resistance, Flexibility and Low yellow index

Balanced Film

Products Thickness Width Length Adhesion Features
um mm M gf/25mm

BF Series

150 470 100 700

Control wafer warpage

CR Series

145 470 100 1000

Control wafer warpage