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Backside Grinding & Backside Metallization Tape
| Product | Total Thickness | Base Film | UV Type | Adhesive Strength | Features | |
| Before UV | After UV | |||||
Unit |
um |
|
|
gf/25mm |
|
|
BGT-001 |
120 |
PET |
- |
200 | - | ● Excellent TTV (≤3 um) ● Peeling easily without residue |
BGT-002 |
170 |
PO |
- |
240 | - | |
BGT-003 |
130 |
PET |
● |
1800 | < 30 | ● Excellent TTV (≤3 um) ● UV release without residue |
BGT-004 |
180 |
PO |
● |
1800 | < 30 | |
BGT-005 |
330 |
PET |
● |
≧800 | ≦100 | ● BGBM Process ● Anti-warpage & Excellent TTV (≤3 um) ● Heat Resistance & Chemical Resistance
|
BGT-006 |
380 |
PO |
● |
≧600 | ≦150 | |
BGT-007 |
320 |
PET |
JC-730 |
≧1600 | ≦100 | |
BGT-008 |
210 |
Composites |
● |
≧1000 | ≦30 | ● Micro (<40um) and Low Bump (<75um) Wafer Thinning
● Excellent filling property, bonding at low Temp. (60°C) ● Anti-warpage & Excellent TTV (≤3 um) ● UV release without residue |
BGT-009 |
450 |
Composites |
- |
40 | - | ● Middle Bump (75~150um) Wafer Thinning
● Excellent filling property, bonding at low Temp. (60~70°C) ● Anti-warpage & Excellent TTV (≤3 um) ● Easy peeling without residue |
BGT-010 |
300 |
Composites |
- |
150 | - | ● Middle Bump (75~150um) Wafer Thinning
● Excellent filling property, bonding at low Temp. (40~60°C) ● Anti-warpage & Excellent TTV (≤3 um) ● Easy peeling without residue (40~60℃) |
BGT-013 |
115 |
PO |
● |
> 800 | < 30 | ● Thin Wafer Grinding
● Anti-warpage & Excellent TTV (≤3 um) ● UV release without residue and damage |
Clean Pad
| Product | Yield | Life Time | Wear Out | O/S Rate | Features |
CP Series |
>98% | 100,000 | <5um | <0.5% | ● Effective Cleaning ● Improve Test Yield ● Needle Shape Protection ● Practically Witho/p> |
FT Series |
>98% | >300 | <5um | <0.5% |
Release Layer for Laser debond<
| Product | Solid Content | Curing Condition | Viscosity | Color | Features |
| % | ℃ | cps | |||
Thor-100 |
5±2 | 100 | <100 | Colorless | Laser debonding |
Thor-200A |
8±2 | 240 | <100 | Black | Laser debonding |
Thor-200B |
15±2 | 240 | <100 | Black | Laser debonding< |
Colorless Polyamic acid
| >Products | Solid Content | Viscosity | Imidization | Color | Features |
| % | cps | ℃ | |||
JC-730 |
12±2 | 2000-4000 | 300 | Light yellow | High clarity, Heat-resistant, Chemical resistance, Flexibility and Low yellow index |
Balanced Film
| Products | Thickness | Width | Length | Adhesion | Features |
| Unit | um | mm | M | gf/25mm | |
BF Series |
150 | 470 | 100 | 700 |
● Warpage Control ● Thermal Stability ● Chemical Resistance ● Wide Applicability |
CR Series |
145 | 470 | 100 | 1000 |
Molding Release Film
| Product | Thickness | Tensile Strength | Elongation | Impedance | Features |
| Unit | um | kgf/mm2 | % | Ω/□ | |
MRF-001 |
48 | 16 | 90 | <1011 |
● Wrinkleless, Antistatic ● Burr Prevention, Residue-free ● Heat-resistant (150~180℃) ● Without oozing when molding |
MRF-002 |
63 | - | - | - |